Two Major CCL Manufacturers Announce Price Hikes

November 28, 2025

In January, the Electronic Materials Division of Nan Ya Plastics Corporation issued a "Cost Adjustment Notice for Copper-Clad Laminate (CCL) in November 2025," stating that due to collective price increases in upstream raw materials such as international LME copper prices, copper foil processing fees, and electronic-grade glass fabric, and to ensure long-term stable supply, it has decided to uniformly increase the prices of all CCL products and prepreg (PP) by 8% effective November 20th (based on the delivery date).

The notification specifically mentioned "considering long-term stable supply," indirectly reflecting that rising raw material prices have created sustained pressure on corporate production. Since the second half of 2025, LME copper prices have remained consistently high above 70,000 RMB/ton, and the supply gap for electronic-grade glass fabric has widened due to reduced production capacity. The cost increase for related raw materials has exceeded 15% compared to the beginning of the year.

On December 1st, the CCL giant Kingboard issued a price increase notice, citing a sharp rise in raw material cost pressures. The notice announced an immediate price increase for its entire range of CCL products, with hikes ranging between 5% and 10%.

This adjustment applies to all CCL products of various thicknesses under the company. The specific adjustment plan is as follows:
• CEM-1/22F/V0/HB Series: Price increase of 5%;
• FR-4 Series: Price increase of 10%;
• PP (Prepreg) Series: Price increase of 10%.

As a leading global enterprise in the CCL industry, Kingboard's price adjustment covers mainstream product categories. The differentiated increase rates across categories better align with the cost structures of different products. Notably, FR-4, the most widely used substrate in the PCB industry, will see a 10% increase, directly affecting the procurement costs of downstream PCB manufacturers.

Within just half a month, the two leading copper clad laminate enterprises have successively adjusted their prices, marking that the pressure of raw material costs has been fully transmitted from the upstream to the midstream manufacturing end. Industry data shows that copper foil accounts for about 30% to 40% of the cost of copper clad laminates and glass cloth accounts for about 20% to 30%. After the collective price increase of raw materials this time, the unit production cost of copper clad laminate enterprises has increased by 8% to 12%.

For downstream PCB manufacturers, if they cannot pass on the costs through product price increases, the profit margins of small and medium-sized manufacturers will be further squeezed. Leading PCB enterprises might digest the pressure by adjusting order structures and optimizing supply chains. Whether more CCL companies will follow suit with price adjustments remains to be seen, depending on the ongoing trend of raw material prices and the demand absorption capacity of the terminal market.